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RK320 Reflow oven    Reflow oven   
Description

Reflow oven RK320



  • Reflow oven RK320
  • Technical Data
  • Lead free
  • yes
  • Heating area
  • max. 320 x 220 mm
  • Heating system
  • top und bottom - separately and selectively controlled
  • Clearance for assemblies
  • max. 35 mm
  • Heating controlling
  • Free programmable for temperature curve setting in graphical mode
  • 4 thermocouples inside heating chamber
  • 1 interface for additional thermocouple - direct measurement on the PCB
  • Heat distribution
  • high power heating element with force air heating method
  • Cooling
  • Dual channel air circulation for fast cool down process
  • Heating temperatures
  • 30 - 290 °C
  • Soldering process time
  • ca. 4 - 5 min per cycle of 300x200 mm PCB
  • Rated power
  • max. 3500 W / typ. 1000 W
  • Power requirements
  • 210-230 VAC / 50-60Hz
  • Dimension and wight
  • 555 x 480 x 300mm / ca.30 kg
  • Features
  • Ethernet and USB Interface for external PC
  • 6 permanently installed thermocouples inside the heating chamber
  • 1 interface for a flexible thermocouple inside the heating chamber
  • Fume extractor interface - diameter 80mm
  • cost effective soldering process
  • stores up any number of profiles
  • fully automatic, fully static ( non moving rail ) operation
  • for single or double side board soldering
  • large transparent glass window see trought the soldering process

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subject to technical alteration
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