Reflow oven RK360

Advanced Reflow Oven with Large Heating Area and Profile Control

The RK360 is a fully automatic, static reflow oven designed for professional SMT soldering applications. With a large 460 × 410 mm heating area and 35 mm component clearance, it supports both single- and double-sided PCB assemblies.

Featuring independently controlled top and bottom heaters, programmable temperature curve control, and six integrated thermocouples, it offers precise thermal profiling with optional real-time PCB measurement.

Forced air heating and dual-channel cooling (with automatic exhaust) ensure even temperature distribution and rapid cool-down. Ideal for lead-free processes, the RK360 combines industrial-level capabilities with a compact design and PC connectivity via Ethernet or USB.

Key Features

• Large heating area: 460 × 410 mm
• Top and bottom heaters independently controlled
• Fully programmable thermal profile control
• 6 internal thermocouples + 1 external probe interface
• Soldering temperature range: 30–300 °C
• Cycle time: approx. 4–5 min per 300 × 200 mm PCB
• Forced air heating and dual-channel active cooling
• Lead-free compatible
• Ethernet and USB interfaces for PC connection
• Automatic exhaust port opening
• Fume extraction port (⌀ 80 mm)
• Fully static operation – no moving rails
• Large transparent viewing window
• Compact footprint: 675 × 630 × 300 mm, approx. 55 kg